AmpTec and Cold Jet participated in the recent Thin Wall Packaging Asia conference held at the Grand Copthorne Waterfront Hotel in Singapore from 20 to 21 September. Those that attended the event include Mr Ken Teng, MD of AmpTec and Mr Jan Cloots, Director of Cold Jet Europe.
Organised by Applied Market Information (AMI), the conference was aimed at industry players in thermoformed and injection moulded packaging. The conference addressed future packaging demands, technology, and market trends. Some new requirements are expected to drive the development of fast-cycle lightweight packaging, barrier packaging for long-life products and packaging with superior decoration. Thin wall plastic packaging like tubs, cups, pots, trays and clamshells, provides a means of supplying consumer appeal, convenience and product protection.
As the industry progresses with the new developments in packaging, Cold Jet, with their technology innovation, is the ideal partner to industry manufacturers for their facility and production maintenance. Proven packaging applications for Cold Jet dry ice blasting include ovens, slicers, labellers, gluers, mixers among others.